Packaging (Semiconductors)
Packaging is the final step where the chip is prepared for real-world use.
Steps include:
- Cutting the wafer into individual chips (dies)
- Attaching the chip to a package
- Connecting it using tiny wires or bumps
- Encasing it in protective material
Why it matters:
- Protects the chip from damage
- Helps with heat dissipation
- Makes it possible to plug into circuits or devices